Nasdaq

Cadence Integrity 3D-IC Platform Supports TSMC 3DFabric™ Technologies for Advanced Multi-Chiplet Designs

The Cadence 3D-IC solution centers on the Integrity 3D-IC platform, which provides integrated planning, implementation and system analysis to optimize PPA for multi-chiplet systems The Tempus Timing ...
Nasdaq

Cadence Integrity 3D-IC Platform Qualified by Samsung Foundry for Native 3D Partitioning Flow on 5LPE Design Stack

Integrity 3D-IC is Cadence’s next-generation multi-chip design solution, integrating silicon and package planning and implementation with system analysis and signoff to enable system-driven PPA ...
Business Wire

Cadence Integrity 3D-IC Platform Certified for TSMC 3DFabric Offerings

SAN JOSE, Calif.--(BUSINESS WIRE)--Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced the leading Cadence ® Integrity ™ 3D-IC platform has achieved certification for and met all reference ...
DATAQUEST

Cadence and Samsung Foundry deepen 2nm and 3D‑IC collaboration to meet surging AI infrastructure and physical AI demand

All of the above from Cadence will be on Samsung Foundry’s second-generation 2nm node for next-generation AI infrastructure ...
Design-Reuse

Cadence Accelerates System Innovation with Breakthrough Integrity 3D-IC Platform

SAN JOSE, Calif., 06 Oct 2021-- Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced the delivery of the Cadence ® Integrity ™ 3D-IC platform, the industry’s first comprehensive, high-capacity ...
Business Wire

Cadence Expands Collaboration with Samsung Foundry, Providing Differentiated Reference Flows Based on the Integrity 3D-IC Platform

Companies advance multi-die planning and implementation, leveraging Cadence’s Integrity 3D-IC platform, the industry’s only unified platform that combines system planning, packaging and system-level ...
Design-Reuse

Cadence Integrity 3D-IC Platform Supports TSMC 3DFabric Technologies for Advanced Multi-Chiplet Designs

SAN JOSE, Calif. -- October 26, 2021-- Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that it is working with TSMC to accelerate 3D-IC multi-chiplet design innovation. As part of the ...
01Net

Cadence Integrity 3D-IC Platform Qualified by Samsung Foundry for Native 3D Partitioning Flow on 5LPE Design Stack

SAN JOSE, Calif.–(BUSINESS WIRE)–Cadence Design Systems, Inc. (Nasdaq: CDNS), a collaborative partner in the Samsung Advanced Foundry Ecosystem (SAFE ™), today announced that Samsung Foundry has ...